It’s the perfect solution for a 3D printing ecosystem that doesn’t waste 20% of the total plastic on packaging. The design of the MakerSpool is fairly straightforward and also 3D printable.

optimal topology choices using the ARM Total Design and Chiplet System Architecture. “3D packaging is challenging but it can be simplified with early architecture exploration.”, says Deepak Shankar, ...

You might wish to include a pattern to decorate areas of the packaging that don't have any writing or images. Vary the number of features to change the effect that a package design has on the buyer.

Design in 3D, document in 2D, collaborate in the cloud, access insights for design research, and experience your projects in mixed reality. Intuitive 3D modeler plus unlimited cloud storage ...

CLO Virtual Fashion hosted its Enterprise User Summit in Munich with over 80 fashion brands, designers, and industry leaders.

Packaging equipment design and packaging equipment fabrication services specialize in the design and fabrication of packaging equipment and packaging products. Packaging equipment design and ...

From state-of-the-art materials and process technology to advanced circuit design and packaging ... and power devices with its novel 3D magnetic packaging technology, known as MagPack.

Faces - A face is a flat surface on a 3D shape. For example a cube has 6 faces. Edges - An edge is where two faces meet. For example a cube has 12 edges. Vertices - A vertex is a corner where ...

If you're considering a packaging degree, you're stepping into a dynamic world with a multitude of career opportunities. Packaging science is a multidisciplinary field that focuses on the design, ...

More affordable than ever, 3D printers are booming for personal, professional, and educational use. Here's everything to know before you buy one, along with the top models from our hands-on testing.

In a 2018 survey, 72% of American consumers stated that their purchase decisions were influenced by a product’s packaging design. In 2021, Lydia Simmons, founder of M.O.O. (Mom’s Official ...

including "Lakefield" processors using a 3D packaging design. Intel has revealed some of the innovations it will be putting to use in its upcoming processors, with the introduction of higher ...