There is one organic material that dominates the semiconductor packaging market, specifically for advanced packages built on interposers and substrates. That material is Ajinomoto buildup film, or ABF ...
From bioplastics to circular models, packaging firms are adopting smarter methods to reduce waste, meet regulations, and attract environmentally aware consumers.
The worldwide polystyrene packaging market is poised for growth and is anticipated to reach an estimated value of US$ 24.01 billion by 2023. Sales of polystyrene packaging are expected to exhibit ...