The shift toward SDVs is leading to cloud-based workflows, virtual testing, and continuous integration pipelines.

EPC Space has announced the EPC7030MSH, a radiation-hardened 300-V GaN FET for high-voltage, high-power space applications.

Microchip has added secure code signing, FOTA updates, and CRA compliance to its ECC608 TrustMANAGER authentication IC.

ST’s L9800 combines eight low-side drivers with diagnostics and protection in a compact leadless package for tight automotive ...

xMEMS is bringing its µCooling fan-on-chip platform to AI-driven extended reality (XR) smart glasses. The silicon-based solid ...

There are numerous evergreen chips in the semiconductor industry, and this blog provides a sneak peek at some of these ...

Using the Take Back Half approach to effectively “take back” the error terms for theoretically zero integral nonlinearity.

Using a reconfigured common-mode choke as an isolation transformer to analyze the open-loop response of a Peltz oscillator.

How much would you pay for a limited-edition new wearable product? If you’re anything like this engineer: a pretty penny.

Wafer-scale accelerators for AI applications can deliver far more computing power with much greater energy efficiency.

ST’s FlightSense 8×8 multizone ToF ranging sensor employs tailored AI algorithms for enhanced human presence detection in ...

Siemens expands Samsung Foundry collaboration, certifying more EDA tools for Samsung’s most advanced process technologies.